Electroloytic Hard Gold

  • ¼ inch required for connection.
  • No solder or tin residue.
  • No overdeveloped resist.
  • Double check for resist breakdown.

Electroloytic Soft Gold

  • ¼ inch required for connection.
  • No solder or tin residue.
  • No overdeveloped resist.
  • Double check for resist breakdown.
  • > 80 micro-inches of Gold, use 3 mil resist.
  • Use resist especially for Gold
  • No finger prints or scratches
  • No pits or nicks
  • No step plating

Electroloytic Nickel Plating

  • Make sure that boards are not undeveloped
  • Use resist especially for Gold.
  • No resist breakdown in non-plated through holes
  • No finger prints or scratches
  • No pits or nicks, step plating
  • Check for connections

ENIG

  • No solder or tin residue.
  • No plugged holes
  • Do not use scrubber prior to plating (Could leave residue).
  • Eliminate boarders as much as possible.
  • Through rinse and solder strip.
  • No under or over etch.


Selective Gold(ENIG)

  • Use only approved resist for ENIG
  • Via holes should be plugged on both sides.
  • Do not under or over develop
  • Use resist especially for Gold.
  • No resist breakdown in non-plated through holes
  • No finger prints or scratches
  • No pits or nicks
  • No step plating

Nickel Palladium Gold – ENIPIG

  • 24-Hour notice required.
  • No resist or taping allowed.
  • Do not over or under etch.
  • No defects on the surface.
  • Via holes should be plugged on both sides

OSP

  • Clean boards
  • Legend complete.
  • Send panels in slip sheets.
  • No finger prints or scratches
  • Do not over or under develop
  • Re-work must be done before OSP.
  • No plugged holes

Certifications